Autor:	E.-H. Wong, Y.-W. Mai
Rok vydání:	2015
Předmět:	Printed circuit board Materials science Flexural strength Soldering Metallurgy Stress–strain curve Rate dependent Test method Composite material Deformation (engineering) Strain hardening exponent
DOI:	10.1016/b978-1-84569-528-6.00012-5
Popis:	Chapter 12 is dedicated to establishing the dynamic stress–strain characteristics of solder materials. The solder joints experience extensive plastic deformation during the flexural deformation of the printed circuit board assembly in the JEDEC test standard JESD22-B111 and in the high-speed cyclic bend test method described in
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::d4072af47d66175754aaf0c770973f37 https://doi.org/10.1016/b978-1-84569-528-6.00012-5 Zobrazit plný text záznamu