Method and apparatus for scanning, stitching and damping measurements of a double sided metrology inspection tool

Autor: Paul J. Sullivan, Hans J. Hansen, David W. Shortt, Rodney Smedt, Daniel Kavaldjiev, Christopher F. Bevis, George Kren
Rok vydání: 2010
Předmět:
Zdroj: The Journal of the Acoustical Society of America. 128:961
ISSN: 0001-4966
DOI: 10.1121/1.3481733
Popis: A system for inspecting specimens such as semiconductor wafers is provided. The system provides scanning of dual-sided specimens using a damping arrangement which filters unwanted acoustic and seismic vibration, including an optics arrangement which scans a first portion of the specimen and a translation or rotation arrangement for translating or rotating the specimen to a position where the optics arrangement can scan the remaining portion(s) of the specimen. The system further includes means for stitching the scans together, thereby providing both damping of the specimen and the need for smaller and less expensive optical elements.
Databáze: OpenAIRE