| Popis: |
Monolithic 3D heterogeneous integration is the most cost effective route to realize continued scaling in power and performance in integrated circuit technologies. In this paper, we discuss a variety of methods, materials, and device concepts to help overcome the constraints imposed by putting active devices in the upper levels. Our focus is on realizing better materials at low processing temperature for logic, memory, and dense interconnects taking advantage of unique physics to surmount current limitations in 3D integrated device performance. |
