Emerging interconnects: a state-of-the-art review and emerging solutions
| Autor: | Satish M. Turkane, A. K. Kureshi |
|---|---|
| Rok vydání: | 2017 |
| Předmět: |
010302 applied physics
Interconnection Materials science Nanotechnology 02 engineering and technology Carbon nanotube Integrated circuit State of the art review Dissipation 021001 nanoscience & nanotechnology 01 natural sciences Electromigration law.invention law 0103 physical sciences Dynamic demand Electrical and Electronic Engineering 0210 nano-technology Graphene nanoribbons |
| Zdroj: | International Journal of Electronics. 104:1107-1119 |
| ISSN: | 1362-3060 0020-7217 |
| DOI: | 10.1080/00207217.2017.1285436 |
| Popis: | Aluminium was a primary material for interconnection in integrated circuits (ICs) since their inception. Later, copper was introduced as interconnect material which has better metallic conductivity and resistance to electromigration. As the aggressive technology scaling continues, the copper resistivity increased because of size effects, which causes increase in delay, power dissipation and electromigration. The need to reduce the resistor-capacitor delay, dynamic power utilisation and the crosstalk commotion is as of now the fundamental main impetus behind the presentation of new materials. The purpose of this paper is to do a survey of interconnect material used in IC from introduction of ICs to till date. This paper studies and reviews new materials available for interconnect application which are optical interconnects, carbon nanotube (CNT), graphene nanoribbons (GNRs) and silicon nanowires which are alternatives to copper. While doing a survey of interconnect material, it is found that... |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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