Decomposition of Cu6Sn5 particles in solder for the growth of a ternary (Cu1−xNix)6Sn5 layer on a Ni substrate

Autor:	Bo Mook Chung, Kyoung Kook Hong, Joo Youl Huh
Rok vydání:	2009
Předmět:	Materials science Rapid rate Diffusion Metallurgy Metals and Alloys Substrate (electronics) Condensed Matter Physics Decomposition Chemical engineering Mechanics of Materials Soldering Phase (matter) Materials Chemistry Ternary operation Layer (electronics)
Zdroj:	Metals and Materials International. 15:487-492
ISSN:	2005-4149 1598-9623
DOI:	10.1007/s12540-009-0487-8
Popis:	The interaction between Cu6Sn5 particles in the bulk of a solder and a Ni substrate was examined during solid-state aging using Cu/Sn/Ni and Cu/Sn/Cu/Sn/Ni diffusion couples with initially thin Cu layers. The results clearly demonstrated that the (Cu,Ni)6Sn5 particles dispersed in the bulk solder decomposed in order for a ternary (Cu1−xNix)6Sn5 layer to grow at the solder/Ni interface during solid-state aging. The interaction between the (Cu,Ni)6Sn5 particles and the (Cu1−xNix)6Sn5 layer occurs owing to the driving force for the (Cu,Ni)6Sn5 compound to become saturated with Ni. A (Ni,Cu)3Sn4 layer forms at the (Cu1−xNix)6Sn5/Ni interface only after the Ni composition of the (Cu,Ni)6Sn5 phase in the bulk solder approaches that of the (Cu1−xNix)6Sn5 layer. Once the (Ni,Cu)3Sn4 layer has formed, it grows at an exceptionally rapid rate by consuming the (Cu1−xNix)6Sn5 and Sn layers, which can be problematic in solder joint reliability.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::d3931fc97d0bcde901042608d12d8916 https://doi.org/10.1007/s12540-009-0487-8 Zobrazit plný text záznamu Full text from SpringerLink