| Autor: |
Han Seo Cho, Hyo-Hoon Park, Jung-Hwan Choi, Seong-Ook Park, Jung-Sub Lee, Kun-Mo Chu, Duk Young Jeon |
| Rok vydání: |
2006 |
| Předmět: |
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| Zdroj: |
IEEE Transactions on Advanced Packaging. 29:409-414 |
| ISSN: |
1521-3323 |
| DOI: |
10.1109/tadvp.2006.875417 |
| Popis: |
This paper describes low-temperature flip-chip bonding for both optical interconnect and microwave applications. Vertical-cavity surface-emitting laser (VCSEL) arrays were flip-chip bonded onto a fused silica substrate to investigate the optoelectronic characteristics. To achieve low-temperature flip-chip bonding, indium solder bumps were used, which had a low melting temperature of 156.7degC. The current-voltage (I-V) and light-current (L-I) characteristics of the flip-chip bonded VCSEL arrays were improved by Ag coating on the indium bump. The I-V and L-I curves indicate that optical and electrical performances of Ag-coated indium bumps are superior to those of uncoated indium solder bumps. The microwave characteristics of the solder bumps were investigated by using a flip-chip-bonded coplanar waveguide (CPW) structure and by measuring the scattering parameter with an on-wafer probe station for the frequency range up to 40 GHz. The indium solder bumps, either with or without the Ag coating, provided good microwave characteristics and retained the original characteristic of the CPW signal lines without degradation of the insertion and return losses by the solder bumps |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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