| Autor: |
Tomoya Tamura, Seh-Jin Park, Guojing Zhang, Yuta Sato, Kazunori Omata, Hal Kusunose, Andy Ma, Ted Liang |
| Rok vydání: |
2009 |
| Předmět: |
|
| Zdroj: |
SPIE Proceedings. |
| ISSN: |
0277-786X |
| Popis: |
Extreme ultraviolet lithography (EUVL) is a leading technology to succeed optical lithography for high volume production of 22 nm node and beyond. One of the top risks for EUVL is the readiness of defect-free masks, especially the availability of Mo/Si mask blanks with acceptable defect level. Fast, accurate and repeatable defect inspection of substrate and multi-layer (ML) blank is critical for process development by both blank suppliers and mask makers. In this paper we report the results of performance improvements on a latest generation mask blank inspection tool from Lasertec Corporation; the MAGICS M7360 at Intel Corporation's EUV Mask Pilot Line. Inspection repeatability and sensitivity for both quartz substrates (Qz) and ML blanks are measured and compared with the previous Phase I tool M7360. Preliminary results of high speed scan correction mirror implementation are also presented |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
|
