Angular spectrum tailoring in solid immersion microscopy for circuit analysis
| Autor: | Peilin Song, Darrell L. Miles, John Sylvestri, S.B. Ippolito |
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| Rok vydání: | 2008 |
| Předmět: |
Materials science
Physics and Astronomy (miscellaneous) business.industry ComputingMethodologies_IMAGEPROCESSINGANDCOMPUTERVISION Physics::Optics Hardware_PERFORMANCEANDRELIABILITY Dielectric Chip law.invention Angular spectrum method Computer Science::Hardware Architecture Optics Optical path Optical microscope law Microscopy Hardware_INTEGRATEDCIRCUITS Optoelectronics Monochromatic color business Refractive index |
| Zdroj: | Applied Physics Letters. 92:101109 |
| ISSN: | 1077-3118 0003-6951 |
| DOI: | 10.1063/1.2892656 |
| Popis: | A structure for locating a fault in a semiconductor chip. The chip includes a substrate on a dielectric interconnect. A first electrical response image of the chip, which includes a spot representing the fault, is overlayed on a first reflection image for monochromatic light in an optical path from an optical microscope through a SIL/NAIL and into the chip. The index of refraction of the substrate exceeds that of the dielectric interconnect and is equal to that of the SIL/NAIL. A second electrical response image of the chip is overlayed on a second reflection image for the monochromatic light in an optical path in which an optical stop prevents all subcritical angular components of the monochromatic light from being incident on the SIL/NAIL. If the second electrical response image includes or does not include the spot, then the fault is in the substrate or the dielectric interconnect, respectively. |
| Databáze: | OpenAIRE |
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