Arrays of holes fabricated by electron-beam lithography combined with image reversal process using nickel pulse reversal plating
| Autor: | Prasad Kelkar, Kien Mun Lau, Melanie Cloutier, Jacques Beauvais, Eric Lavallee, Pan Yang, Yousef Awad, Dominique Drouin, David Turcotte |
|---|---|
| Rok vydání: | 2004 |
| Předmět: |
Materials science
business.industry Nanotechnology Surfaces and Interfaces Condensed Matter Physics Surfaces Coatings and Films chemistry.chemical_compound Resist Silicon nitride chemistry Etching (microfabrication) Plating Optoelectronics Reactive-ion etching Electroplating business Lithography Electron-beam lithography |
| Zdroj: | Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. 22:1040 |
| ISSN: | 0734-2101 |
| DOI: | 10.1116/1.1647589 |
| Popis: | A critical issue in fabricating arrays of holes is to achieve high-aspect-ratio structures. Formation of ordered arrays of nanoholes in silicon nitride was investigated by the use of ultrathin hard etch mask formed by nickel pulse reversal plating to invert the tonality of a dry e-beam resist patterned by e-beam lithography. Ni plating was carried out using a commercial plating solution based on nickel sulfamate salt without organic additives. Reactive ion etching using SF6/CH4 was found to be very effective for pattern transfer to silicon nitride. Holes array of 100 nm diam, 270 nm period, and 400 nm depth was fabricated on a 5×5 mm2 area. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
|