Densely packed optoelectronic interconnect using micromachined springs
| Autor: | Christopher L. Chua, T. Hantschel, D.K. Fork |
|---|---|
| Rok vydání: | 2002 |
| Předmět: |
Interconnection
Materials science Cantilever Silicon Packaging engineering business.industry chemistry.chemical_element Temperature cycling Atomic and Molecular Physics and Optics Electrical contacts Electronic Optical and Magnetic Materials Surface micromachining chemistry Optoelectronics Integrated circuit packaging Electrical and Electronic Engineering business |
| Zdroj: | IEEE Photonics Technology Letters. 14:846-848 |
| ISSN: | 1941-0174 1041-1135 |
| DOI: | 10.1109/lpt.2002.1003113 |
| Popis: | We demonstrate a novel optoelectronic packaging technology interconnecting 200 element independently addressable vertical-cavity surface-emitting laser arrays on 6-/spl mu/m pitch to silicon driver chips with equally dense output lines. The room-temperature flip-chip process utilizes micromachined cantilevers for establishing electrical contact. Thermal cycling and thermal shock tests show excellent package reliability. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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