The Increase Factor of Residual Stress and the Suppression on Thick Films Prepared by Copper Sulfate Plating

Autor:	Masami Shibata, Yosuke Abe, Keisuke Ogura
Rok vydání:	2015
Předmět:	Materials science Residual stress Plating Metallurgy General Engineering Copper sulfate
Zdroj:	Journal of the Surface Finishing Society of Japan. 66:277-281
ISSN:	1884-3409 0915-1869
DOI:	10.4139/sfj.66.277
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::d250b0f514016758338c3df3389e95f4 https://doi.org/10.4139/sfj.66.277 Zobrazit plný text záznamu