New polyimide for multi-chip module application

Autor:	D. Makino, Kojima Mitsumasa, Toru Kikuchi, H. Satou, Takayuki Saito
Rok vydání:	2002
Předmět:	Permittivity chemistry.chemical_classification chemistry.chemical_compound Materials science chemistry Multi-chip module Polymer Propagation delay Dielectric Composite material BPDA Thermal expansion Polyimide
Zdroj:	40th Conference Proceedings on Electronic Components and Technology.
DOI:	10.1109/ectc.1990.122273
Popis:	P-terphenyltetracarboxylic dianhydride (p-TPDA), which has a rodlike structure, has been developed as a raw material for polyimides in order to reduce the propagation delay time associated with polyimide packaging for multichip modules. The coefficient of thermal expansion (CTE) of the polyimides derived from p-TPDA is approximately 2*10/sup -6/. This is much lower than that of conventional polyimides derived from bisphenyltetracarboxylic dianhydride (BPDA), which have a CTE of 8*10/sup -6/ K/sup -1/. Another attribute that these polyimides have is low dielectric constant, with a typical value of about 2.9. As a result, this polyimide can give improved performance when used in multichip module applications. >
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::d23d60dec598474ba0f63beac5adf549 https://doi.org/10.1109/ectc.1990.122273 Zobrazit plný text záznamu