Highly Sensitive Electron-Beam Negative Resists Utilizing Phenylcarbinol as Dissolution-Inhibitor Precursor
Autor: | Hiroshi Shiraishi, Takumi Ueno, Michiaki Hashimoto, Sonoko Migitaka, Shou-ichi Uchino, Jiro Yamamoto, Kyoko Kojima |
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Rok vydání: | 1996 |
Předmět: | |
Zdroj: | Journal of Photopolymer Science and Technology. 9:685-691 |
ISSN: | 1349-6336 0914-9244 |
DOI: | 10.2494/photopolymer.9.685 |
Popis: | Chemically amplified negative resists made by utilizing the polarity-change reaction of phenylcarbinol were investigated for electron beam lithography. The resist composed of 1, 3-bis(α-hydroxyisopropyl)benzene (Diol-1), m/p-cresol novolak resin, and diphenyliodonium trifluoromethanesulfonate (DITf) showed the best lithographic performance in terms of sensitivity and contrast among the resists using phenylcarbinol. Fine 0.25-μm line-and-space patterns were formed by using this Diol-1 resist with a dose of 3.6 μC/cm2 in conjunction with a 50-kV electron beam exposure system. |
Databáze: | OpenAIRE |
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