| Popis: |
The plating bath temperature has a critical influence on the damascene gap fill quality. Scanning electron microscopy studies indicated that over a small temperature range from 20 to 30 °C defect-free electroplated Cu fill was obtained. The effect was attributable to the initial nucleation and the chemistry of the plating bath, particularly the functionality of the additives. Secondary ion mass spectroscopy analysis showed different impurity levels of H, C, O, S, and Cl incorporated within the films. X-ray diffraction analysis on blanket Cu films indicated that, although all the Cu films had roughly the same (111) texture strength after plating, after a high temperature anneal at 450 °C for 30 min, the films deposited at higher temperatures exhibited much stronger (111) texture than the others. However, x-ray pole figure analysis of Cu lines with 0.35 μm linewidth and 0.40 μm spacing indicated roughly the same (111) texture intensity after the anneal. The shortened transformation time and more tensile str... |
