An investigation of various post-RIE cleaning processes for dry etched InP-based HEMTs

Autor: Werner Bächtold, H.C. Duran, I. Pfund, Rebecca Cheung, G. Hähner, W. Patrick
Rok vydání: 1997
Předmět:
Zdroj: Microelectronic Engineering. 35:67-70
ISSN: 0167-9317
DOI: 10.1016/s0167-9317(96)00150-5
Popis: Post-RIE cleaning processes after the dry gate recess etching step of lattice-matched InGaAs/InAlAs/InP-HEMTs using an oxygen plasma treatment of the surface followed by various wet chemical steps have been investigated. The treated surfaces have been analyzed using X-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM). In addition, the electrical characteristics have been assessed by DC and microwave measurements of HEMT devices. A considerable improvement of the surface quality using post-RIE cleaning has been observed, resulting in better electrical device performance.
Databáze: OpenAIRE