Development of novel AlN filler for high thermal conductivity packaging material
| Autor: | Y. Kanechika, K. Kuramto, Y. Fukunaga, Y. Imoto, Y. Inaki, S. Fujii, M. Wang, T. Nawata, M. Ueda |
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| Rok vydání: | 2018 |
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| Zdroj: | 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC). |
| DOI: | 10.23919/icep.2018.8374654 |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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