A low cost leadless package concept

Autor:	Klaus Pressel, S. Paulus, Horst Theuss, Jochen Dangelmaier
Rok vydání:	2004
Předmět:	Engineering business.industry Chip-scale package Wireline Package on package Electrical engineering Low Pin Count Temperature cycling Quad Flat No-leads package Integrated circuit packaging business Automotive engineering Dual in-line package
Zdroj:	Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).
Popis:	We report an innovative low cost leadless package concept with an ultra-miniaturized footprint and a significant height reduction. The package height has the potential to be made smaller than 0.4 mm. For discrete and low pin count solutions the package space can consume much less than 50% of present available standard packages. The package fulfills the typical first and second level reliability tests which include temperature cycling, pressure cooker or drop tests for low pin count solutions < 10 pins. We show results that the small and short contact pins lead to an excellent RF performance. The package is not only highly attractive for the discrete market, it also has remarkable potential for medium pin-count solutions. The package is capable for wireless and wireline solutions.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::d0a9d60ed8a56a60a67b7151e92be038 https://doi.org/10.1109/eptc.2003.1271504 Zobrazit plný text záznamu