A Review of 3-Dimensional Wafer Level Stacked Backside Illuminated CMOS Image Sensor Process Technologies

Autor:	Shou-Gwo Wuu, Hsin-Li Chen, Ho-Ching Chien, Paul Enquist, R. Michael Guidash, John McCarten
Rok vydání:	2022
Předmět:	Electrical and Electronic Engineering Electronic Optical and Magnetic Materials
Zdroj:	IEEE Transactions on Electron Devices. 69:2766-2778
ISSN:	1557-9646 0018-9383
DOI:	10.1109/ted.2022.3152977
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::d086a12fa2d02262ab6d2a4269ee2ec9 https://doi.org/10.1109/ted.2022.3152977 Zobrazit plný text záznamu