Optimization of deposition uniformity during silicon epitaxy in deep trenches

Autor:	E.V. Yakovlev, A.S. Segal, Roman Talalaev, Johan Meersman, Jelle Genne, Freddy De Pestel, H. Ziad, Gerhard Koops, Denis Bazarevskiy, Marnix Tack
Rok vydání:	2019
Předmět:	Materials science Silicon business.industry chemistry.chemical_element Condensed Matter Physics Epitaxy Electronic Optical and Magnetic Materials chemistry Trench Materials Chemistry Optoelectronics Electrical and Electronic Engineering business Deposition (chemistry)
Zdroj:	Semiconductor Science and Technology. 34:024001
ISSN:	1361-6641 0268-1242
DOI:	10.1088/1361-6641/aaf4eb
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::d066237d2be7943cb3963aed27e4a7d4 https://doi.org/10.1088/1361-6641/aaf4eb Zobrazit plný text záznamu