High frequency characterization and modelling of inkjet printed interconnects on flexible substrate for low-cost RFID applications

Autor:	Ran Liu, Li-Rong Zheng, W. Zapka, Roshan Weerasekera, A.T. Woldegiorgis, Botao Shao
Rok vydání:	2008
Předmět:	Printed circuit board Materials science Hardware_GENERAL Hardware_INTEGRATEDCIRCUITS Silver ink Electronic engineering Equivalent circuit Distributed parameter model Substrate (printing) Polyimide substrate Flexible electronics Characterization (materials science)
Zdroj:	2008 2nd Electronics Systemintegration Technology Conference.
DOI:	10.1109/estc.2008.4684435
Popis:	This paper presents the characterization and modeling of inkjet printed interconnects on flexible polyimide substrate using nano-particle silver ink for low-cost RFID applications. Then TDR/TDT and S-parameter measurements are performed at high frequency from 30 kHz to 6 GHz. A lumped equivalent circuit and distributed parameter model of the printed interconnects have been developed for the realization of the full printed RFID tags. Additionally the related electrical properties of the printed interconnects are extracted.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::cff6e0e6c62fdebec5c9454d91c74799 https://doi.org/10.1109/estc.2008.4684435 Zobrazit plný text záznamu