Room Temperature Cu-Cu Direct Bonding Using Wetting/Passivation Scheme for 3D Integration and Packaging

Autor:	Zhong-Jie Hong, Demin Liu, Shu-Ting Hsieh, Han-Wen Hu, Ming-Wei Weng, Chih-I Cho, Jui-Han Liu, Kuan-Neng Chen
Rok vydání:	2022
Zdroj:	2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits).
DOI:	10.1109/vlsitechnologyandcir46769.2022.9830175
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::cfd8de8691a4a1bcc1e434bc3fdf078d https://doi.org/10.1109/vlsitechnologyandcir46769.2022.9830175 Zobrazit plný text záznamu