Thermal Conductivity of NI HTS Coil Fabricated by Diffusion Bonding Technique

Autor:	Junil Kim, Hongsoo Ha, Myung-Hwan Sohn, Sung-Kyu Kim, Gwantae Kim, Jaehwan Lee, Jeongmin Mun, Seokho Kim
Rok vydání:	2022
Předmět:	Electrical and Electronic Engineering Condensed Matter Physics Electronic Optical and Magnetic Materials
Zdroj:	IEEE Transactions on Applied Superconductivity. 32:1-5
ISSN:	2378-7074 1051-8223
DOI:	10.1109/tasc.2022.3172917
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::cfc57dc0b94d32693b052c8dbf17cfdc https://doi.org/10.1109/tasc.2022.3172917 Zobrazit plný text záznamu