Wafer Level Packaging of GaN/Si SAW Band Pass Filters with Operating Frequencies Above 5 GHz

Autor:	Alina-Cristina Bunea, Adrian Dinescu, Dan Neculoiu
Rok vydání:	2018
Předmět:	Materials science business.industry Coplanar waveguide Surface acoustic wave Gallium nitride Chip chemistry.chemical_compound chemistry Band-pass filter Transmission line Extremely high frequency Optoelectronics business Wafer-level packaging
Zdroj:	2018 International Semiconductor Conference (CAS).
Popis:	This paper proposes a quasi-wafer level packaging approach of surface acoustic wave band pass filters (SAW-BPF) with operating frequencies above 5 GHz. A Poly(methyl methacrylate) (PMMA) cap is designed, fabricated and glued using an epoxy resin directly on the GaN/Si chip. First a coplanar waveguide transmission line is packaged and measured up to 65 GHz. Results show additional insertion losses of only 0.1 dB up to millimeter wave frequencies. A 5.6 GHz SAW-BPF is then packaged using the same approach. Measurement results show excellent properties of the packaged device for a temperature range between −150 … + 150°C.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::cf5864aeb8c95a63d5a9ee8570cc4777 https://doi.org/10.1109/smicnd.2018.8539748 Zobrazit plný text záznamu