UV/ozone treatment for adhesion improvement of copper/epoxy interface
| Autor: | Shingyu Bok, Byungkwon Lim, Guh-Hwan Lim |
|---|---|
| Rok vydání: | 2017 |
| Předmět: |
Materials science
Ozone General Chemical Engineering chemistry.chemical_element Substrate (chemistry) 02 engineering and technology Epoxy Adhesion 010402 general chemistry 021001 nanoscience & nanotechnology 01 natural sciences Copper 0104 chemical sciences Metal chemistry.chemical_compound Chemical engineering chemistry X-ray photoelectron spectroscopy visual_art visual_art.visual_art_medium Organic chemistry 0210 nano-technology Layer (electronics) |
| Zdroj: | Journal of Industrial and Engineering Chemistry. 46:199-202 |
| ISSN: | 1226-086X |
| DOI: | 10.1016/j.jiec.2016.10.031 |
| Popis: | We developed a simple and efficient method for adhesion improvement of Cu/epoxy interface by utilizing UV/ozone treatment for surface oxidation of Cu substrates. X-ray photoelectron spectroscopy analysis revealed that metallic Cu surface was directly oxidized to CuO and Cu(OH)2 by UV/ozone treatment. The adhesion of a UV/ozone-treated and then silane-coated Cu substrate to a molded epoxy layer was greatly improved compared to that of a bare Cu substrate. Using this approach, we obtained the peel strength as high as 0.46 kgf/cm from a low-roughness Cu substrate with Rq of ∼0.1 μm. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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