Thermal Stress and Creep Strain Analyses of a 3D IC Integration SiP with Passive Interposer for Network System Application
| Autor: | Heng-Chieh Chien, Ra-Min Tain, John H. Lau, Sheng-Tsai Wu, Peng Su, Yu-Lin Chao, Li Li, M. Brillhart, Jie Xue |
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| Rok vydání: | 2012 |
| Předmět: |
Dynamic random-access memory
Materials science business.industry Three-dimensional integrated circuit Hardware_PERFORMANCEANDRELIABILITY Chip law.invention Printed circuit board Application-specific integrated circuit law Soldering Automotive Engineering Hardware_INTEGRATEDCIRCUITS Electronic engineering Interposer Optoelectronics business Dram |
| Zdroj: | International Symposium on Microelectronics. 2012:001038-001045 |
| ISSN: | 2380-4505 |
| Popis: | In this study, the nonlinear thermal stress distributions at the Cu-low-k pads of Moore's law chips and creep strain energy density per cycle at the solder joints of a 3D IC integration system-in-package (SiP) are investigated. At the same time, the warpage of the TSV interposer and reliability assessment of solder joints in the architecture is examined. The analyzed structure comprises one PCB (printed circuit board), one BT (bismaleimide triazene) substrate, one interposer with through silicon vias (TSVs), two DRAM (dynamic random access memory) chips and one high power ASIC (application specific integrated circuit) chip. The high power chip and DRAM chips are supported, respectively on the top-side and bottom-side of the Cu-filled TSV interposer. |
| Databáze: | OpenAIRE |
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