| Autor: |
DaeByoung Kang, Jaedong Kim, Christopher M. Scanlan, Dongjoo Park, Lee J. Smith, Choonheung Lee, Tae-Kyung Hwang, Kwang Ho Kim, Curtis Zwenger, Jinseong Kim, Mahmoud Dreiza, Robert Francis Darveaux, Christopher J. Berry, Kiwook Lee |
| Rok vydání: |
2008 |
| Předmět: |
|
| Zdroj: |
2008 58th Electronic Components and Technology Conference. |
| DOI: |
10.1109/ectc.2008.4550110 |
| Popis: |
In recent years, package-on-package (PoP) has been rapidly adopted for 3D integration of logic and memory within mobile handsets and other portable multimedia devices. However, existing methods of making the PoP base package may not satisfy next generation applications that will require reduced memory interface pitches, higher memory interface pin-counts, reduced thickness, tight warpage control and higher levels of integration within the PoP base package. This paper introduces a new PoP base package structure that addresses the challenges of next generation applications. A PoP base package with through mold vias (TMV) will be described. Package flatness and package stacking results will be presented and advantages of TMV technology will be reviewed. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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