The multichip module as a board-level package

Autor:	D. B. Knorr
Rok vydání:	1995
Předmět:	Engineering Interconnection business.industry General Engineering Substrate (printing) Automotive engineering System requirements visual_art visual_art.visual_art_medium Electronic engineering General Materials Science Lower cost Ceramic Hardware_ARITHMETICANDLOGICSTRUCTURES business
Zdroj:	JOM. 47:27-30
ISSN:	1543-1851 1047-4838
DOI:	10.1007/bf03221200
Popis:	Leading-edge packaging applications are demanding some combination of greater interconnect density, smaller size, higher system performance, and lower cost. The elimination of the chip-level package in favor of the direct attachment of chips to a substrate or board is an alternative that is being actively developed for many prospective applications and commercially implemented in specific situations. This multichip module (MCM) approach takes many forms depending on both the system requirements and the ever-present cost constraints. The cost/performance trade-off drives the selection of materials system: laminate board (MCM-L), multilayer ceramic (MCM-C), or deposited thin films (MCM-D). The shift to MCM technology will continue selectively, where the needs and the benefits are compelling.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::ceb3d6edb4fd82b061f89d66befa2f2b https://doi.org/10.1007/bf03221200 Zobrazit plný text záznamu Full text from SpringerLink