Development of a Resinoid Diamond Wire Containing Metal Power for Slicing a Silicon Ingot
| Autor: | Mari Suzuki, Toshiyuki Enomoto, Yutaka Shimazaki, Yuichi Kanda, Yasuhiro Tani |
|---|---|
| Rok vydání: | 1999 |
| Předmět: |
Materials science
Silicon Mechanical Engineering Abrasive Metallurgy Wire saw Diamond Mechanical engineering chemistry.chemical_element Hardware_PERFORMANCEANDRELIABILITY engineering.material Slicing Industrial and Manufacturing Engineering chemistry Machining Mechanics of Materials Hardware_INTEGRATEDCIRCUITS engineering Wafer Ingot |
| Zdroj: | TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series C. 65:1235-1240 |
| ISSN: | 1884-8354 0387-5024 |
| DOI: | 10.1299/kikaic.65.1235 |
| Popis: | A recent technological trend in semiconductor industries is the use of a large silicon wafer to improve the productivity and reduce the cost of silicon devices. The ID-blade traditionally being used for slicing a silicon ingot, deteriorates the through put when being applied to a large size ingot. The wire saw slicing technology, therefore, has attracted attention and is now replacing the ID-blade slicing technology. The wire sawing with loose abrasives is widely employed today, but the process has problems of dirty environment and inefficiency. To overcome these problems, fixed abrasive wire saw processes have been introduced, namely an electrodeposited diamond wire and a resinold diamond wire. These fixed abrasive wires, however, still have several problems when being applied to a practical use. We have developed the resinold diamond wire containing metal powder to settle the problems. A series of experiments revealed that a newly developed wire has a good mechanical/ thermal property and a good machining characteristic. |
| Databáze: | OpenAIRE |
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