| Autor: |
Nistor Daniel Trip, Cornelia Gordan, Lucian Morgos, Adrian Burca, Dorin Sabau |
| Rok vydání: |
2019 |
| Předmět: |
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| Zdroj: |
2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME). |
| DOI: |
10.1109/siitme47687.2019.8990679 |
| Popis: |
In this paper is presented a smart monitoring system that is able to detect, prior to the periodic maintenance service, a set of malfunctions that may negatively influence the quality of the solder joints on PCB but also the process productivity using a reflow soldering equipment. The proposed smart monitoring system use a vibration and temperature sensor, an industrial controller and a program that offers a real time user interface. The smart monitoring system assures with its capabilities a fast intervention of the process operator in order to eliminate all undesired production problems and to assure the quality of the electronic products. This approach is novel and actual as yet were reported in the last period other kind of improvements for the reflowing process. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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