Electroless Metallic Coating on Plastic Parts Produced by Rapid Prototyping Technique
| Autor: | Nitesh Kumar Dixit, Rakesh Narain, Rajeev Srivastava |
|---|---|
| Rok vydání: | 2017 |
| Předmět: |
chemistry.chemical_classification
Chemical resistance Thermoplastic Materials science chemistry.chemical_element 02 engineering and technology 010402 general chemistry 021001 nanoscience & nanotechnology Elastomer 01 natural sciences Copper 0104 chemical sciences chemistry.chemical_compound Hydrofluoric acid chemistry Chemical engineering Plating Chromic acid Composite material 0210 nano-technology Phosphoric acid |
| Zdroj: | Materials Today: Proceedings. 4:7643-7653 |
| ISSN: | 2214-7853 |
| DOI: | 10.1016/j.matpr.2017.07.098 |
| Popis: | Plating is use to improve the performance of component by providing a metallic layer on to the surface of component. Plating of ABS (acrylonitrile-butadiene-styrene) parts has been studied on four different geometries parts surface. These parts are produced by rapid prototyping technique using the layer-wise deposition principles. Due to its excellent toughness, good dimensional constancy, good process capability, chemical resistance and cheapness, ABS is used for part fabrication. ABS is engineering thermoplastic composed of an elastomer namely butadiene dispersed as a grafted particulate phase in a thermoplastic matrix of styrene and acrylonitrile copolymer. These parts are further Metalize by using electroless copper deposition technique. Two distinct processes have been considered for surface preparation of parts such as aluminum carbon black paste (Al-C paste) coated ABS parts, and ABS parts prepared using chromic acid for etching. After surface conditioning of parts using these routes, Cu (copper) is deposited electrolessly using four different acidic solutions. The acidic solution has contained 5 wt% CuSO 4 (copper sulphate) with 15 wt% of individual H 2 SO 4 (sulphuric acid), HF (hydrofluoric acid), H 3 PO 4 (phosphoric acid), and CH 3 COOH (acetic acid) acids for the preparation of four different acidic solution. Deposition of copper in different acidic solutions for different two routes at room temperature for 24hr and 48 hr is carried out. Further, the results are analyzed and compared based on their electrical conductivity measurement, scanning electron microscopy (SEM), and energy dispersive X-ray spectroscopy (EDS). Outcome shows that Al-C pasted samples demonstrated better electrical performance and more even Cu deposition in all acidic solutions in comparison to other route adopted for surface preparation. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
|
Full Text from ScienceDirect