| Autor: |
Yajie Wang, Xueqing Cui, Changyong Fan, P. Jacob, M. Held, Wuchen Wu, Yangang Wang |
| Rok vydání: |
2005 |
| Předmět: |
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| Zdroj: |
2001 6th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.01EX443). |
| DOI: |
10.1109/icsict.2001.982074 |
| Popis: |
Latch-up failure is one of the most important failure phenomena of IGBT modules because of the p-n-p-n sandwich device structure. Half-bridge IGBT modules latch-up failure was observed by a switching test. The SEM technique was employed in the failure analysis work in order to investigate how the module was destroyed by latching-up. This paper reports the failure analysis results and the relevant analysis techniques used in the work. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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