| Autor: |
W. Rehm, S. Kerboeuf, P.J. Laroulandie, D. Tregoat, C. Artigue, D. Keller, B. Fernier, J.L. Nicque, A. Goth, C. Duchemin, P. Berthier, P. Aribaud, J. Scherb, J. Lauckner, A. Tournereau, K. Adam, S. Rabaron, Emmanuel Grard, W. Jorg, J.M. Rainsant |
| Rok vydání: |
2002 |
| Předmět: |
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| Zdroj: |
2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070). |
| DOI: |
10.1109/ectc.2000.853241 |
| Popis: |
A passive assembly process for laser modules has been developed that is based on silicon submounts with 3-dimensional structures and corresponding laser chips. It makes use of surface tension effects to pull the chips into their final position defined by mechanical stops and stand-offs. Full singlemode compatible accuracy is achieved. A prefabricated plastic housing with an integrated optical connector completes the concept. Due to the eliminated fixed fiber pigtail and the materials that are used all elements are compatible with automated surface mounting (SMT) into the system electronics. All these details contribute to the low cost technology for high performance laser modules. Although active cooling is not provided laser modules are capable of 2.5 mW emission for environmental temperatures as high as 85/spl deg/C. The concept is open for other applications like receivers and more complex integrated devices. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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