Minimizing residual stress of aluminum nitride (AlN) thin films using multi-step deposition of DC pulsed sputtering

Autor:	Wei-Lun Chen, Shang Shian Yang, Ning Hsiu Yuan, Wei Yu Zhou, Yu-Pu Yang, Hsiao-Han Lo, Peter J. Wang, Walter Lai, Yiin-kuen Fuh, Tomi T. Li
Rok vydání:	2022
Zdroj:	2022 China Semiconductor Technology International Conference (CSTIC).
DOI:	10.1109/cstic55103.2022.9856787
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::cddd7e4d1d43201ef88ab89b39a3b0bd https://doi.org/10.1109/cstic55103.2022.9856787 Zobrazit plný text záznamu