An interferometric method for simultaneous measurement of thickness, refractive index, and surface profile of a silicon wafer
| Autor: | Jungjae Park, Jaeseok Bae, Jonghan Jin |
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| Rok vydání: | 2022 |
| Zdroj: | Optical Manufacturing and Testing XIV. |
| DOI: | 10.1117/12.2632346 |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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