Effects of solder joint structure and shape on thermal reliability of plastic ball grid array package
| Autor: | S. C. Tseng, C. S. Wan, Rong-Sheng Chen |
|---|---|
| Rok vydání: | 2005 |
| Předmět: |
Materials science
Mechanical Engineering Metallurgy Solder paste Temperature cycling Industrial and Manufacturing Engineering Computer Science Applications Core (optical fiber) Printed circuit board Control and Systems Engineering Soldering Ball grid array Composite material Deformation (engineering) Joint (geology) Software |
| Zdroj: | The International Journal of Advanced Manufacturing Technology. 27:677-687 |
| ISSN: | 1433-3015 0268-3768 |
| Popis: | Among the PBGA (plastic ball grid array) packages, a 72-I/O OMPAC (overmolded effect array carrier) package is studied during thermal cycling. The ANSYS software is applied to analyze the effects of some factors on the solder joint for the fatigue life due to elastoplastic deformation of the electronic package; those factors are solder structure, shape, and pitch. The result shows that the maximum equivalent plastic strain range occurs at two interfaces, one is between the solder joint and the substrate, another one is between the solder joint and the printed circuit board. Moreover, the solder shape is determined by the solder height and the pad diameter under a fixed value of solder volume. It is found that the convex-shaped solder with larger height and smaller pitch has smaller maximum equivalent plastic strain range, which leads to the longer fatigue life. In addition, there are two kinds of solder structure: pure solder joint and copper core solder joint. In the copper core solder joint, the eutectic part becomes so small that a larger strain is induced. Therefore, the pure solder joint has smaller maximum equivalent plastic strain range and longer fatigue life than the copper core solder joint. |
| Databáze: | OpenAIRE |
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