Removable Polyurethane Encapsulants
| Autor: | J. G. Curro, G. L. Cessac, K. B. Wischmann |
|---|---|
| Rok vydání: | 1977 |
| Předmět: |
Materials science
Polymers and Plastics Modulus 02 engineering and technology Epoxy 021001 nanoscience & nanotechnology Elastomer Casting chemistry.chemical_compound Thermoplastic polyurethane 020401 chemical engineering chemistry Creep visual_art Ultimate tensile strength Materials Chemistry visual_art.visual_art_medium 0204 chemical engineering Composite material 0210 nano-technology Polyurethane |
| Zdroj: | Journal of Elastomers & Plastics. 9:299-311 |
| ISSN: | 1530-8006 0095-2443 |
| DOI: | 10.1177/009524437700900305 |
| Popis: | Two castable thermoplastic polyurethane formulations have been developed for use as removable electronics packaging materials. The first formulation would be employed in situations where some elastomeric properties are desired. Mechanical properties for this formulation are: tensile strength 1675 psi, elongation 480%, and modulus 2.2 X 104 psi. The second formulation more closely simulates an epoxy resin and the mechanical properties are: tensile strength 6040 psi, elongation 6.5%, and modulus 2.8 X 105 psi. Both casting resins can be filled (e.g., with Al2O3) which reduces the coefficient of thermal expansion (~ 80 X 10-6 to ~ 40 X 10-6/°C) and susceptibility to creep. The two formulations are soluble in polar organic solvents such as dimethylformamide and tetrahydrofuran. Both formulations were synthesized in bulk and based on reaction rate studies, they exhibit a diffusion controlled process in the latter stages of reaction. |
| Databáze: | OpenAIRE |
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