Plasma Damage Effects on SiO2 Thin Films Determined by Nanoindenter Under Various Etching Conditions Using ACP Source

Autor:	Hong-Ki Kim, Soo In Kim, Sang Jin Kim, Nam-Hun Kim, Sang Il Seo, Chang Woo Lee, Jae-Hoon Lee
Rok vydání:	2016
Předmět:	Materials science Etching (microfabrication) General Materials Science Nanotechnology Nanoindenter Plasma Thin film Damage effects
Zdroj:	Science of Advanced Materials. 8:1778-1782
ISSN:	1947-2935
DOI:	10.1166/sam.2016.2897
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::cd2a5efc1baf8a3bf5ce162fd94cf244 https://doi.org/10.1166/sam.2016.2897 Zobrazit plný text záznamu