Reliability evaluation of electronic devices
| Autor: | A. Nishimura, Sueo Kawai, M. Kitano, Shimizu Tasuku, T. Hattori |
|---|---|
| Rok vydání: | 1991 |
| Předmět: |
Thermal oxidation
Fabrication Materials science Silicon business.industry Mechanical Engineering technology industry and agriculture chemistry.chemical_element Fracture mechanics Condensed Matter Physics Reliability (semiconductor) Semiconductor chemistry Mechanics of Materials Soldering General Materials Science Adhesive Composite material business |
| Zdroj: | Materials Science and Engineering: A. 143:247-256 |
| ISSN: | 0921-5093 |
| DOI: | 10.1016/0921-5093(91)90744-8 |
| Popis: | Stresses due to thermal oxidation and film deposition processes during the fabrication of a semiconductor are analysed. The strengths of plastic encapsulants, silicon chips, bonding wires and adhesive interfaces in integrated-circuit (IC) plastic packages are evaluated using fracture mechanics and other techniques. The thermal fatigue strength of solder joints is then estimated using the fatigue test data of solder specimens and simplified modelling of IC packages. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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