Measurement of Young's modulus and residual stress of copper film electroplated on silicon wafer
| Autor: | Ming-Jun Wang, Chunsheng Yang, Ji-An Chen, Li Wang, Wen Ding, Yong Zhou, Ya-Ming Zhang, Guifu Ding, Tai-Hua Zhang |
|---|---|
| Rok vydání: | 2004 |
| Předmět: |
Materials science
Silicon Metallurgy Metals and Alloys Modulus chemistry.chemical_element Young's modulus Surfaces and Interfaces Nanoindentation Copper Surfaces Coatings and Films Electronic Optical and Magnetic Materials symbols.namesake chemistry Residual stress Materials Chemistry symbols Nanoindenter Thin film |
| Zdroj: | Thin Solid Films. 460:175-180 |
| ISSN: | 0040-6090 |
| Popis: | The Young's modulus and residual stresses of electroplated copper film microbridges were measured. Special ceramic shaft structure was designed to solve the problem of getting the load-deflection curves of the microbridges from a nanoindentation system equipped with a normal Berkovich probe. Theoretical analysis of the load-deflection curves of the microbridges is proposed to evaluate the Young's modulus and residual stress of the copper films simultaneously. The calculated results based on the experimental measurements showed that the average Young's modulus and residual stress of the electroplated copper films are 115.2 GPa and 19.3 MPa, respectively, while the Young's modulus measured by the nanoindenter for the same copper film with silicon substrate is 110±1.67 GPa. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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