Effect of Zn Additions on Thermal and Mechanical Properties of Sn-0.7Cu-xZn Solder Alloy
| Autor: | I.N.A. Ibrahim, Mohd Izrul Izwan Ramli, Rita Mohd Said, Mohd Arif Anuar Mohd Salleh |
|---|---|
| Rok vydání: | 2018 |
| Předmět: |
010302 applied physics
Materials science Metallurgy chemistry.chemical_element 02 engineering and technology Zinc 021001 nanoscience & nanotechnology Condensed Matter Physics 01 natural sciences Atomic and Molecular Physics and Optics chemistry 0103 physical sciences Thermal General Materials Science 0210 nano-technology Solder alloy |
| Zdroj: | Solid State Phenomena. 280:200-205 |
| ISSN: | 1662-9779 |
| DOI: | 10.4028/www.scientific.net/ssp.280.200 |
| Popis: | This research examines the influences of minor addition of Zn on the thermal and mechanical properties in Sn-0.7Cu solder alloy. The addition of 0.5, 1.0 and 1.5 wt.% of Zn were added into Sn-0.7Cu by using conventional casting method. It show that minor Zn addition has refined and promoted the nucleation of β-Sn phase. The vickers hardness show a increases the hardness of Sn-0.7Cu solder alloy with increasing amount of Zn. For thermal properties, with a small addition of Zn, it did not change the melting but has a slight decrease the undercooling of Sn-0.7Cu solder alloy. |
| Databáze: | OpenAIRE |
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