Electrical, optical, and fluidic interconnect networks for 3D heterogeneous integrated systems

Autor:	Muhannad S. Bakir, B. Dang, Calvin King, D.C. Sekar
Rok vydání:	2008
Předmět:	Interconnection Engineering Stack (abstract data type) business.industry Embedded system Distributed computing Constraint (computer-aided design) Integrated systems Key (cryptography) System integration Fluidics Photonics business
Zdroj:	2008 IEEE Avionics, Fiber-Optics and Photonics Technology Conference.
DOI:	10.1109/avfop.2008.4653149
Popis:	Three-dimensional (3D) system integration is widely accepted as a key enabler for future systems. Although there are a number of approaches to 3D integration, none have addressed the need for cooling in a 3D stack of high-performance chips (microprocessors). This is a significant omission and imposes a constraint on the ability to fully utilize the benefits of 3D technology. Thus, new 3D integration technologies are needed for high-performance applications as well as those that require the integration of photonics within the 3D stack.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::cbd2fa4e5df1d052bd67cfb4fdec4387 https://doi.org/10.1109/avfop.2008.4653149 Zobrazit plný text záznamu