| Autor: |
Toshihisa Nonaka, Tomoaki Shibata, Satoshi Yoneda, Xinrong Li, Naoya Suzuki |
| Rok vydání: |
2020 |
| Předmět: |
|
| Zdroj: |
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC). |
| DOI: |
10.1109/estc48849.2020.9229755 |
| Popis: |
This work presents the imprint-thorough mold via (i-TMV) concept applicable for compartmental level electromagnetic interference (EMI) shielding. The i-TMV structure could be successfully fabricated by imprinting with the silicon master and filling with the conductive paste. We have fabricated a daisy-chained i-TMV test vehicle and it showed good connectivity. In order to study the EMI shielding properties, the electric field simulation was performed. Single and triple-array structures were modeled based on the fabricated test vehicle, and compared with the structure without via array. The result showed that the i-TMV could provide excellent EMI shielding. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
|
