Lowering curing temperature in adhesive bonding of aluminum AA6061-T4
| Autor: | Pei-Chung Wang, Charles Fan, Yi-min Guo, Zhongxia Liu, Yuan Li, Bin Cai, Sheng-nan Wang |
|---|---|
| Rok vydání: | 2018 |
| Předmět: |
Materials science
Adhesive bonding Acetylacetone chemistry.chemical_element 030206 dentistry 02 engineering and technology Surfaces and Interfaces General Chemistry 021001 nanoscience & nanotechnology Surfaces Coatings and Films 03 medical and health sciences chemistry.chemical_compound 0302 clinical medicine chemistry Mechanics of Materials Aluminium Materials Chemistry Adhesive Composite material 0210 nano-technology Curing (chemistry) |
| Zdroj: | The Journal of Adhesion. 94:893-909 |
| ISSN: | 1545-5823 0021-8464 |
| DOI: | 10.1080/00218464.2017.1377077 |
| Popis: | To minimize the part distortion and investment in the E-coat oven in adhesive bonding of metals for automotive applications, lowering the curing temperature of adhesive without apparent loss of the joint strength is desirable. The key to lower the curing temperature of adhesive bonding of lightweight materials is to accelerate the curing process of structural adhesives. In this study, curing agent (i.e., aliphatic polyamine) and curing accelerator (i.e., acetylacetone salt) were added into commercial Henkel 5089 adhesive and the effect of these curing additives on the curing temperature of Henkel 5089 in adhesive bonding of aluminum AA6061-T4 was studied. The test results showed that the addition of a curing agent and accelerator in Henkel 5089 lowered the curing temperature from 177°C to 130°C without sacrificing the strength of the adhesive-bonded aluminum AA6061-T4. |
| Databáze: | OpenAIRE |
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