Failure Mechanisms and Mechanical Characterization of Reactive Bonded Interfaces

Autor:	Ronny Gerbach, Matthias Petzold, Fabian Schippel, Georg Lorenz, Bianca Boettge, Joerg Bagdahn, Falk Naumann, Lutz Berthold
Rok vydání:	2013
Předmět:	Materials science Silicon chemistry Scanning electron microscope Ultimate tensile strength chemistry.chemical_element Substrate (electronics) Composite material Nanoindentation High-resolution transmission electron microscopy Microstructure Layer (electronics)
Zdroj:	ECS Transactions. 50:215-225
ISSN:	1938-6737 1938-5862
DOI:	10.1149/05007.0215ecst
Popis:	This study presents results of microstructure diagnostics and mechanical strength investigations for reactive bonded components. For this purpose silicon (Si) test specimen were bonded by using commercially available 40 µm thick nickel/aluminum (Ni/Al) NanoFoils{copyright} with a 10 µm thick tin (Sn) solder layer on both sides. Scanning electron (SEM) and high resolution transmission electron microscopy (HRTEM) in combination with energy dispersive X-ray spectroscopy (EDXS) at the bond interface showed the formation of silver-copper-tin (Ag-Cu-Sn) and tin-silver (Sn-Ag) intermetallics within the Sn solder matrix. The hardness and modulus of the solder layer were characterized by Berkovich nanoindentation testing. Results from strength investigations using tensile and micro chevron testing revealed a strong bonding strength of the interface. SEM analyses of the fracture surfaces showed both, cohesive failure through the solder layer and adhesive failure between the silicon substrate and the gold-chrome coating layer.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::caf9b7d9a273c032efe0471039217ff5 https://doi.org/10.1149/05007.0215ecst Zobrazit plný text záznamu