INVESTIGATION OF THE INTERFACE OF THE DCB SUBSTRATE
| Autor: | Yonggang Wang, Fuxiang Huang, Usheng Ma, Zhiting Geng, Honglong Ning, Jiman Zhu |
|---|---|
| Rok vydání: | 2003 |
| Předmět: |
Materials science
Metallurgy chemistry.chemical_element Surfaces and Interfaces Substrate (electronics) Condensed Matter Physics Microstructure Copper Surfaces Coatings and Films Metal chemistry visual_art Materials Chemistry visual_art.visual_art_medium Eutectic bonding Melting point Ceramic Composite material Eutectic system |
| Zdroj: | Surface Review and Letters. 10:95-99 |
| ISSN: | 1793-6667 0218-625X |
| DOI: | 10.1142/s0218625x03004640 |
| Popis: | DCB means direct copper bonding and denotes a process in which copper and a ceramic material are directly bonded. Between the temperature of the metal's melting point and the eutectic temperature of the metal-oxygen, DCB depends on the eutectic compound to join the copper and the ceramic. We do some research to investigate the interface between the copper foils and Al2O3 ceramics; it is the key factor in influencing the performance of the DCB substrate. We also discuss how to get good microstructure of the DCB interface. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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