| Autor: |
Kent M. Geib, Randy Jurrat, E. M. Hayes, H.Q. Hou, S.A. Feld, R.D. Snyder, Carl W. Wilmsen, Kent D. Choquette |
| Rok vydání: |
2002 |
| Předmět: |
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| Zdroj: |
Digest IEEE/Leos 1996 Summer Topical Meeting. Advanced Applications of Lasers in Materials and Processing. |
| Popis: |
This paper presents a new smart pixel design for a database filter which combines the four chips of a previous system into a single component chip. This eliminates many of the optical components, dramatically reduces the size of the system, and simplifies the optical alignment. The redesigned chip is being fabricated by Vitesse through the MOSIS foundry and uses MSM photodetectors and MESFETs instead of heterojunction phototransistors. VCSELs are flip-chip bump bonded to each pixel using a coplanar bonding technique similar to that developed by Goossen, et. al. (1995) for SEED devices. The paper will describe the pixel design and measured characteristics. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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