Implementation of Terahertz High-Pass Filters Based on All-Metal Microstructures using Deep X-ray Lithography
| Autor: | F. N. Dultsev, D. S. Tanygina, B. G. Goldenberg, V. I. Kondratyev, Sergei A. Kuznetsov, A. N. Gentselev, A. G. Zelinsky |
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| Rok vydání: | 2019 |
| Předmět: |
010302 applied physics
Resistive touchscreen Materials science Terahertz radiation business.industry Condensed Matter Physics 01 natural sciences Cutoff frequency 010309 optics Resist 0103 physical sciences Optoelectronics Wafer X-ray lithography Electrical and Electronic Engineering Electroplating business Instrumentation Lithography |
| Zdroj: | Optoelectronics, Instrumentation and Data Processing. 55:115-125 |
| ISSN: | 1934-7944 8756-6990 |
| DOI: | 10.3103/s875669901902002x |
| Popis: | A method for fabricating high-pass terahertz quasi-optical filters in the form of thick (up to 1 mm in thickness) self-bearing copper microstructures of subwavelength topology is described. This method is based on forming a high-aspect-ratio mask of SU-8 resist on a silicon wafer via deep X-ray lithography through a tungsten X-ray mask followed by electroplating a copper layer through the resistive mask. An example of a 212-µm thick structure with a cutoff frequency of 0.42 THz having the geometry of hexagon-shaped through-holes arranged on a triangular lattice is considered. The results of broadband THz characterization and electromagnetic analysis of the structure fabricated are presented. |
| Databáze: | OpenAIRE |
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