Low profile DC-DC power converter for 3-D electronics assembly

Autor:	S. Baier, Charles Steven Korman, R.L. Steigenvald, A. Peczalski, W. B. Hennessy, R. Wojnarowski, W. Bicknell, R.A. Fisher, S. Ramakrishnan
Rok vydání:	2002
Předmět:	Engineering business.industry Electronic packaging Electrical engineering High density Interconnect technology Avionics Gallium arsenide Power (physics) Form factor (design) chemistry.chemical_compound chemistry Electronic engineering Electronics business
Zdroj:	16th DASC. AIAA/IEEE Digital Avionics Systems Conference. Reflections to the Future. Proceedings.
DOI:	10.1109/dasc.1997.635039
Popis:	A 130 W/in/sup 3/ 48Vdc-to-3.3Vdc power converter has been developed for an avionics distributed power system. This converter employs advanced packaging based on the GE-Lockheed Martin High Density Interconnect technology and new ultra low profile magnetics to provide a 150 mil high form factor that is consistent with high density 3D electronics packaging.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::ca0f9fdda3e1051adc43115d0a32adb1 https://doi.org/10.1109/dasc.1997.635039 Zobrazit plný text záznamu