Micro-XRD Stress And Texture Study Of Inlaid Copper Lines — Influence Of ILD, Liner And Etch Stop Layer

Autor:	J. Rinderknecht, E. Zschech, Holm Geisler, I. Zienert, Hartmut Prinz, P. Besser
Rok vydání:	2004
Předmět:	Stress (mechanics) Crystallography Materials science Stack (abstract data type) chemistry X-ray crystallography chemistry.chemical_element Dielectric Texture (crystalline) Composite material Microstructure Layer (electronics) Copper
Zdroj:	AIP Conference Proceedings.
ISSN:	0094-243X
Popis:	The influence of ILD, liner and etch stop layer on the room temperature stress state of copper line test structures was examined by micro‐XRD. Test structures consisted of large arrays of parallel lines with line widths of 0.18 μm and 1.8 μm. All these parameters have an influence on the room temperature stress state, whereas the variation of the liner and the ILD showed the largest effects. The change from a full low‐k stack to a hybrid stack, where SiO2 ILD is use for the ‘via layer’ only and low‐k material for the ‘line layer’ results in completely different parameter dependencies. The relationship between copper microstructure and the resulting stress in copper lines is discussed.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::ca0875eeeb0718e51bb5b9ad4f34acac https://doi.org/10.1063/1.1845852 Zobrazit plný text záznamu