Laser beam scanning system for irradiation in an external quadrangular form for soldering of quad flat package IC

Autor:	Tetsuya Homma, Hitoshi Tsuchiya
Rok vydání:	2015
Předmět:	Quantum optics Materials science business.industry chemistry.chemical_element Yttrium Atomic and Molecular Physics and Optics Line (electrical engineering) Optics chemistry Aluminium Soldering Reflection (physics) Irradiation Quad Flat Package business
Zdroj:	Optical Review. 22:1-8
ISSN:	1349-9432 1340-6000
DOI:	10.1007/s10043-015-0032-6
Popis:	We propose a new soldering process and a system for a quad flat package IC (QFP-IC). The incident line-formed laser beam converted by this system can realize an external quadrangular form line for the non-contact regional heating, to provide thin and light weight electronic packages as required. The laser beam pumped by an yttrium aluminum garnet (YAG) laser oscillator is split into four beams. Using a galvano motor, which can scan the reflection mirror with high frequencies, the laser beam can change the heating line. The soldering time for QFP-IC of 100 pins with the 0.65 mm pitch was 6 s. As the regional heating just only junctions, the temperature in the resin package was lower than 141 °C after solder fusion. From the experimental result, it is confirmed that this method is less damage to a resin package than a conventional whole heating method.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::c99a56b7536a9dacda80dfb080e66759 https://doi.org/10.1007/s10043-015-0032-6 Zobrazit plný text záznamu Full text from SpringerLink